New Wafer Bonding Machine
Mitsubishi's 12-inch wafer bonding machine is capable of producing 3D integrated LSI (large-scale integration) circuits at room temperature.
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Elecrama 2012 - The inauguration
Mr. Sushilkumar Shinde said that the Indian Power industry is at the cusp of major growth with 80,000 MW of power units under construction.
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Mitsubishi's 12-inch wafer bonding machine is capable of producing 3D integrated LSI (large-scale integration) circuits at room temperature.
The 3-day international exhibition is solely dedicated to the building and construction industries. It will be held from Jan 27-30.
Mr. Sushilkumar Shinde said that the Indian Power industry is at the cusp of major growth with 80,000 MW of power units under construction.
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